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Companies implementing 2.5D Packaging

2.5D packaging, also known as 2.5D interposer technology, is an advanced semiconductor packaging method that mounts multiple dies side‑by‑side on a silicon interposer, acting as an intermediate step between conventional 2‑D packaging and full 3‑D stacking.

List of companies that implement 2.5D Packaging

This is sourced from job postings — companies only hire for what they actively use or plan to adopt · how we source this →

  • Marvell Technology logo
    United StatesEmployees12kRevenue$5.5BSemiconductor Manufacturing
    2.5D PackagingHigh confidence
  • Qualcomm logo
    United StatesEmployees57kRevenue$44BTelecommunications
    2.5D PackagingMedium confidence
  • MosChip® logo
    IndiaEmployees1.8kEngineering Services
    2.5D PackagingMedium confidence
  • Mulya Technologies logo
    IndiaEmployees31Semiconductor Manufacturing
    2.5D PackagingMedium confidence
  • Eridu AI logo
    United StatesEmployees54Semiconductor Manufacturing
    2.5D PackagingMedium confidence
  • Synopsys Inc logo
    United StatesEmployees27kRevenue$4.9BSoftware Development
    2.5D PackagingMedium confidence
  • Celestial AI logo
    United StatesEmployees125Semiconductor Manufacturing
    2.5D PackagingLow confidence
  • Apple logo
    United StatesEmployees293kComputer Hardware Manufacturing
    2.5D PackagingLow confidence
  • Raytheon logo
    United StatesEmployees182kRevenue$71BDefense and Space Manufacturing
    2.5D PackagingLow confidence
  • Socionext US logo
    United StatesEmployees88Semiconductor Manufacturing
    2.5D PackagingLow confidence

Showing top companies out of 50 that implement 2.5D Packaging. Get the full list on TheirStack.

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