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Companies implementing Integrated Fan-Out

Integrated Fan-Out (InFO) is a wafer-level integration method that stacks memory packages and application processors for high‑density, high‑performance mobile devices, forming part of 3D wafer-level system integration.

List of companies that implement Integrated Fan-Out

This is sourced from job postings — companies only hire for what they actively use or plan to adopt · how we source this →

  • Google logo
    United StatesEmployees330kSoftware Development
    Integrated Fan-OutHigh confidence
  • ASM logo
    NetherlandsEmployees2.8kSemiconductor Manufacturing
    Integrated Fan-OutHigh confidence
  • Delos Data logo
    United StatesEmployees23Computer Hardware Manufacturing
    Integrated Fan-OutHigh confidence
  • Siemens EDA (Siemens Digital Industries Software) logo
    GermanyEmployees311kRevenue$81BSoftware Development
    Integrated Fan-OutMedium confidence
  • 众能联合数字技术有限公司 logo
    ChinaEmployees64Technology, Information and Internet
    Integrated Fan-OutMedium confidence
  • MosChip® logo
    IndiaEmployees1.8kEngineering Services
    Integrated Fan-OutMedium confidence
  • Lattice Semiconductor logo
    United StatesEmployees1.7kRevenue$694MSemiconductor Manufacturing
    Integrated Fan-OutMedium confidence
  • HCLTech logo
    IndiaEmployees261kIT Services and IT Consulting
    Integrated Fan-OutMedium confidence
  • Micron Technology logo
    United StatesEmployees48kRevenue$18BSemiconductor Manufacturing
    Integrated Fan-OutLow confidence
  • AMD logo
    United StatesEmployees52kRevenue$23BSemiconductor Manufacturing
    Integrated Fan-OutLow confidence

Showing top companies out of 75 that implement Integrated Fan-Out. Get the full list on TheirStack.

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