Companies implementing Integrated Fan-Out

Integrated Fan-Out (InFO) is a wafer-level integration method that stacks memory packages and application processors for high‑density, high‑performance mobile devices, forming part of 3D wafer-level system integration.

List of companies that implement Integrated Fan-Out

This is sourced from job postings — companies only hire for what they actively use or plan to adopt · how we source this →

CompanyCountryIndustryEmployeesRevenueTechnologies
Country flag

United States

Semiconductor Manufacturing

47k

$23B

Integrated Fan-Out

Country flag

United States

Software Development

306k

Integrated Fan-Out

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Netherlands

Semiconductor Manufacturing

2.7k

Integrated Fan-Out

Country flag

United States

Semiconductor Manufacturing

11k

$5.5B

Integrated Fan-Out

Country flag

United States

Semiconductor Manufacturing

48k

$18B

Integrated Fan-Out

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United States

Semiconductor Manufacturing

125

Integrated Fan-Out

Country flag

United States

Semiconductor Manufacturing

54

Integrated Fan-Out

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Germany

Automation Machinery Manufacturing

311k

$73B

Integrated Fan-Out

Country flag

United States

Semiconductor Manufacturing

455

Integrated Fan-Out

Country flag

United States

Airlines and Aviation

1k

$10M

Integrated Fan-Out

Showing top companies out of 55 that implement Integrated Fan-Out. Get the full list on TheirStack.

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