Companies implementing Three-Dimensional Integrated Circuit (3D IC)

A three‑dimensional integrated circuit (3D IC) is a chip created by stacking silicon wafers or dies and linking them vertically via techniques such as through‑silicon vias or copper‑copper connections.

List of companies that implement Three-Dimensional Integrated Circuit (3D IC)

CompanyCountryIndustryEmployeesRevenueTechnologies
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United States

Semiconductor Manufacturing

64k

$23B

Three-Dimensional Integrated Circuit (3D IC)

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United States

Software Development

28k

$4.9B

Three-Dimensional Integrated Circuit (3D IC)

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United States

Software Development

336k

Three-Dimensional Integrated Circuit (3D IC)

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United States

Semiconductor Manufacturing

57

$4.9M

Three-Dimensional Integrated Circuit (3D IC)

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Germany

Software Development

311k

$81B

Three-Dimensional Integrated Circuit (3D IC)

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United States

Semiconductor Manufacturing

11k

$5.5B

Three-Dimensional Integrated Circuit (3D IC)

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United States

Software Development

11k

Three-Dimensional Integrated Circuit (3D IC)

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United States

Telecommunications

55k

$44B

Three-Dimensional Integrated Circuit (3D IC)

Country flag

United States

Software Development

21k

Three-Dimensional Integrated Circuit (3D IC)

Country flag

United States

Semiconductor Manufacturing

30k

$26B

Three-Dimensional Integrated Circuit (3D IC)

Showing top companies out of 150 that implement Three-Dimensional Integrated Circuit (3D IC). Get the full list on TheirStack.

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